TSMC plans 450mm wafers for 2015/2016

Posted on Friday, December 23 2011 @ 22:33 CET by Thomas De Maesschalck

DigiTimes reports TSMC plans to start volume production of 450mm wafers in 2015 or 2016. Additionally, the foundry also revealed that its 14nm process technology should also be ready for production in 2015.

Taiwan Semiconductor Manufacturing Company (TSMC) will maintain its plans to begin trial production on 18-inch wafers in the 2013-2014 timeframe, with volume production slated for 2015-16, according to the foundry chipmaker.

TSMC expects to have about 95% of its 18-inch produciton equipment and facilities installed in 2014, and start small-volume production on the larger wafers in 2015. Currently, the move to 18-inch wafers still faces technical barriers that have to be solved in collaboration with equipment and material suppliers, TSMC pointed out.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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