TSMC 16nm FinFET+ process to be ready for sampling by year-end

Posted on Monday, March 31 2014 @ 12:02 CEST by Thomas De Maesschalck

Industry sources revealed to DigiTimes that TSMC will likely add two new processes to its lineup to fend off competition from Intel and Samsung's 14nm nodes. Originally, TSMC planned to introduce a single 16nm FinFET process for trial production by the end of the year, but now it seems the company will also roll out a 16nm FinFET+ process by year-end and an even more advanced 16nm FinFET Turbo process in 2015-2016.

The 16nm FinFET+ process is expected to enter volume production in early 2015 and may help TSMC win A9 processor orders from Apple, the sources indicated.

Some mobile fabless customers may directly adopt the 16nm FinFET+ process since it gives an additional die shrink, while migrating from 20nm, according to JP Morgan Securities.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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