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Micron manufacturing DDR4 modules for Xeon servers

Posted on Wednesday, April 02 2014 @ 20:06:40 CEST by


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Micron announced it's ramping up production of DDR4 memory to support Intel's upcoming Xeon E5-2600 v3 family. The initial DDR4 modules will be based on 4Gb memory chips with a frequency of 2133MHz and 2400MHz are expected to follow in 2015.
Micron Technology, Inc., (NASDAQ: MU) a leading provider of advanced memory and storage solutions for enterprise data centers and high-performance computing applications, today announced it is ramping production of DDR4 memory to support upcoming Intel® CPU launches. The improved power and performance of DDR4 technology is a critical requirement for the growing enterprise computing market, delivering a power improvement of up to 35% compared to standard DDR3.

Micron is ramping its 4Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel’s Xeon™ processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.

“Our JEDEC-compliant portfolio showcases the performance and power benefits that DDR4 products can provide for our customers,” said Robert Feurle, Micron’s vice president of marketing and program management. “As a result of Micron’s close engagement with our key enabling partners, we are well positioned to bring this exciting new technology to market.”

“We have been working with Micron since the early days of DDR4 memory definition and through DDR4 product launch,” said Geof Findley, Intel DCG Memory Ecosystem Director. “We are very excited that our mutual customers will be able to reap the benefits of this new memory technology to improve performance and reduce power as part of future Intel® Xeon™ processor E5-2600 v3 product family based systems with production availability of these new processors in 2H’14.”

Micron’s fully JEDEC-compliant DDR4 portfolio includes RDIMMs, LRDIMMs, VLP RDIMMs, UDIMMs and SODIMMs (ECC and non-ECC), as well as x4, x8 and x16 components. NVDIMM customer samples are expected in the early 3Q14 timeframe.



 



 

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