Posted on Wednesday, August 03 2005 @ 1:17 CEST by Thomas De MaesschalckThe Itanium processors will use the 9000 and the Xeon will use the 7000 and 5000 sequence. In 2005-2006 the 9000 sequence will feature the Montecito/Montvale Itanium processors together with the Intel E8870 chipset. The 7000 series will feature Truland, Paxville and Tulsa Xeons with the Intel E8501 chipset, while the 5000 series will feature the Bensley and Dempsey Xeon processors with the Blackford chipset.
Intel also talked about future server platforms that will support new technologies like FB-DIMM memory during 2005-2006.
For 2005-2006 Intel plans to incorporate new platform technologies such as dual-core, Intel Virtualization Tech, Intel I/O Acceleration Tech, FB-DIMM memory, Foxton Technology, Pellston Technology, Intel Active Management Tech and Raid 4.
In the near future the company plans multi-core, enhanced virtualization, enhanced I/O and memory, enhanced RAS, enhanced manageability and the common platform architecture.
Intel's roadmap splits the Xeon platform into three segments:
>br> The Performance Optimized platform which will offer the Irwindale (110W) in the second half of 2005, the dual-core Dempsey in 1H 2006 and the dual-core Woodcrest in 2H 2006. This platform is optimized for best performance for 2U/Pedestal.
The Rack Optimized platform with for the second half of this year the <90W MV Irwindale, in the first half of 2006 the dual-core MV Dempsey and in the second half of 2006 the dual-core MV Woodcrest. This platform is balanced for performance/power for rack density.
Finally there's also the Ultra-Dense platform for applications where power is the number one concern. This platform will feature the 55W LV Irwindale in the second half of this year and the dual-core 31W Sossaman throughout 2006.
More details and roadmap pictures at The Inquirer
