According to ASML, chip makers need one EUV step-and-scan system per EUV layer for every ~45,000 wafer starts per month.
Later this year ASML will introduce its new generation Twinscan NXE: 3400C EUV scanner that will be able to process 170 wafers per hour, up from 155 wafers per hour on the NXE: 3400B. The new scanner will use Cymer’s new 340 W light source, which will enable higher performance. ASML’s Twinscan NXE: 3400C will allow chip manufacturers to keep cycle times for their next-gen chips in check.More details about EUV adoption can be read at AnandTech.