Intel builds $300 million semiconductor assembly and test fab in Vietnam

Intel today announced it will invest $300 million (US) to build a semiconductor assembly and test facility in Ho Chi Minh City. This represents the first such investment by the semiconductor industry in Vietnam and supports Intel’s strategy to invest to support overall demand. Construction of this facility will begin immediately.

“We applaud the progress the country has made in building up their technology infrastructure and the support of education programs to advance the capabilities of the local workforce,” said Intel Chairman Craig Barrett. “Intel looks forward to working with the government and public sector in Vietnam to grow their technology capabilities and competitiveness.”

The latest addition to the global network of assembly and test facilities will supplement Intel’s existing activities in Southeast Asia. As part of Intel’s digital ASEAN (d-ASEAN) program, the company continues to work on the development of a stronger digital workforce, integrating technology into education and government, as well as making technology more accessible for business and consumers.

This new facility is part of Intel’s worldwide expansion of production capacity. By the end of 2006, the company plans to invest over $6 billion worldwide for capital additions. When completed, the Vietnam facility will be the seventh assembly site of Intel’s global network and is projected to eventually employ about 1200 people. Other sites include Penang and Kulim, Malaysia; Cavite, Philippines; Chengdu and Shanghai, China; and San Jose, Costa Rica.