VIA today announced cooperation with industry partners to ensure broad TPM support for VIA's market-leading lineup of chipset solutions for the Intel, AMD, and VIA processor platforms.
Trusted Platform Module (TPM) technology is an industry effort aimed at reducing some of the risks facing modern day computing. Addressing issues such as data theft, unauthorized PC access, and unauthorized network access, the TPM standard incorporates a number of capabilities that will be increasingly important as businesses and users give greater priority to safe computing. The TPM architecture comprises a discrete module connected through the chipset South Bridge, with associated BIOS support. As a premium chipset provider, VIA has been working with industry partners to ensure leading TPM support to meet growing customer requirements.
Working with leading industry partners, VIA has validated STMicroelectronics TPM modules together with VIA's latest South Bridge solutions, and leading BIOS solutions from AMI and Insyde Software supporting TPM technology.
"STMicroelectronic's TPM modules deliver the stability, manageability, and security that form an optimal solution for next generation security requirements," commented Vincent Cousin, of STMicroelectronics Asia Pacific Digital Secure Access Business Unit. "As the first company to offer an integrated TCG 1.2 solution, STMicroelectonics' cooperation with VIA ensures our customers a comprehensive solution for the latest desktop and laptop PCs."