HyperTransport Technology Consortium today released version 3.0 of the HyperTransport specification. The new standard nearly doubles the bandwidth and speed of the previous HyperTransport 2.0 specification. In addition, HyperTransport 3.0 supports a variety of new features including AC coupling mode, hot plugging, un-ganging mode and dynamic power management for the support of extended signal transmission distance, typical of backplane and chassis-to-chassis implementations. HyperTransport 3.0 builds on the existing HyperTransport 1.0 and 2.0 standards which continue to be designed into end systems at an accelerating rate, and have helped HyperTransport reach considerable market presence and success. HyperTransport 3.0 is fully backwards-compatible with earlier versions of the HyperTransport specification standard.
“The added performance and new features of HyperTransport 3.0 extend the applicability of
HyperTransport technology from chip-to-chip and board-to-board, all the way to chassis-tochassis
applications," said Mario Cavalli, general manager of the HyperTransport Technology
Consortium. "HyperTransport has proven to be the industry’s most flexible, powerful and futureready
standard interconnect solution for compute-intensive system designs, delivering a winning
combination of high-performance, standardization and optimized total cost of ownership (TCO) for
data center and supercomputing applications.”