Memory performance is becoming increasingly critical for a wide range of applications including PC gaming, servers, super computing and high-definition television (HDTV). All of these applications process a large amount of data that needs to be accessed quickly and efficiently. To enable the next level of memory performance for these applications, Micron Technology, Inc., is introducing today a 1 gigabit (Gb) double data rate (DDR)3 device that provides these key applications with faster speed, lower power and increased memory density.
"We are excited to introduce the world's first 1Gb DDR3 components," said Brian Shirley, vice president of Micron's memory group. "Micron's strength in advanced DRAM technology has given us the industry leading position in high density memory solutions."
Micron's DDR3 products will support data rates of 800 megatransfers per second (MT/s) to 1,600 MT/s with clock frequencies of 400 megahertz (MHz) to 800 MHz respectively, doubling the speed from DDR2. At DDR3's top speed, a 100,000-page document can be transferred in approximately one second. The DDR3 supply voltage has been reduced from 1.8V to 1.5V, reducing power consumption by up to 30 percent; the device is manufactured on Micron's 78nm process technology. These DDR3 benefits will help enable the next level of performance in a wide array of computing devices.
"Early 2007 should bring memory thirsty computing and consumer applications, such as Microsoft's anticipated Vista operating system. DDR3 will initially benefit the server, notebook, and desktop markets and will then reach consumer applications such as graphics and HDTVs," said Shane Rau, senior analyst of IDC, a market intelligence firm.
Evaluation samples of Micron's leading-edge 1Gb DDR3 components are available to select customers with production expected to begin early next year. Micron's 1Gb DDR3 components will be available in various output configurations (x4, x8 and x16), and will be fully compliant to the most recent JEDEC DDR3 specifications (JEDEC is the leading developer of standards for the semiconductor industry). These components will support module densities from 512 megabytes (MB) through 4 gigabytes (GB) and a variety of module types including FBDIMMs, UDIMMs, SODIMMs, and RDIMMs.
A 2Gb DDR3 device is also expected to be available from Micron early next year, helping to enable even higher density applications.