''New SUPER Thermal Compound''?

Posted on Tuesday, July 15 2003 @ 16:01 CEST by Thomas De Maesschalck
Deborah D.L. Chung invented a new thermal paste, which seems to be better than all other thermal compounds on the market, even better than the exotic thermal pastes based on stuff like diamond which conduct around 5 to 6 times better than silver. I'm wondering if this will really make a big difference in for example cpu temperatures, and when it will be avaible for us all..
In comparative laser-flash testing, Chung's thermal paste -- composed of carbon-filled organic material -- performed better than the leading thermal pastes currently on the market. The results of the testing and the makeup Chung's paste will be described in a forthcoming issue of the journal Carbon.

"The invented material is superior to all other thermal pastes, including those involving exotic materials such as carbon nanotubes and diamond. It even significantly surpasses solder -- the best material currently available -- for improving the thermal contact between two surfaces," she says.

The development of heat sink materials has received much attention for the alleviation of the overheating problem, Chung notes. Development of thermal pastes for improving the thermal contact between the heat source and the heat sink has received relatively little attention, however.
Source : Buffalo.edu

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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