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Intel Prescott Good for cold days, bad for OC?

Posted on Saturday, July 26 2003 @ 19:35:29 CEST by

I already spotted this Japanese report a few days ago, but I don't speak Japanese, and the Babelfish translation was not really well so I decided not to post it, because I could not get too much information out of the article. New the folks over at X-bit Labs have made a summary of the Japanese article!

The first Intel Prescott CPU is planned for November this year, and will cost $637. The first versions will have a 800MHz FSB just like the newest Pentium 4's. Most people are hoping that this CPU will be compatible with the Springdale and Canterwood motherboards on the market, but this is not sure at the moment. The reason why it would not be compatible with most i865 (Sprindale) and i875 (Canterwood) motherboard on the market would be because this CPU demands a lot more power than they had intended, and it will probally become fairly hot :

  Despite of the fact that the code-named Prescott will be made using 90nm fabrication process using Intel Strained Silicon technology, the babe will be very hot and will eat loads of electricity. According to this report, the Prescott 3.60GHz processor’s Thermal Design Power will be about 103W, 15% more from initial expectations of 89W. A version of Prescott processor for DTR notebooks will typically dissipate about 94W heat.

In order to meet such requirements Intel also had to increase the current for such CPUs, and that is an explanation why the most of current mainboards will not be able to work with Intel Prescott processors. For instance, the original Prescott 3.60GHz was intended to work with 78A IcccMax, whereas the real version will only be able to function with current increased to 91A.

The TDP of the Tejas processor manufactured using 90nm technology for Socket T platforms will be well above 100W; keeping in mind that Tejas is expected to achieve 4.0GHz milestone, we can conclude that massive cooling-solutions will be required for cooling-down such monsters.

This is not really good news, and future CPUs will consume even more power, and will even become hotter. This means that heatsinks will need to grow in size, and that we will need a powerful fan on top of it to keep the CPU cool. Watercooling might be a solution, but will not become a standard soon I think.

Source : X-bit Labs



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