Samsung Electronics announced that its thermally-enhanced chip-on-film (TECOF) package for LCD driver ICs that are used in large-size and high-resolution LCD TVs could improve thermal heat dissipation by 20% over a conventional COF package, allowing the driver ICs to last longer and operate with greater reliability.
Samsung has completed reliability testing of this new TECOF package and expects to ship its LCD driver IC under TECOF package technology in the second quarter of 2007.
Samsung said it has developed a new material for the thin metal tape component that could effectively maximizing heat dissipation. By applying the company's s new TECOF package, the thermal emissions from LCD driver IC are quickly released via the metal tape, thus minimizing heat buildup, the company explained.
Samsung's new LCD driver ICs get less hot
Posted on Sunday, Feb 04 2007 @ 09:28 CET by Thomas De Maesschalck