Posted on Sunday, February 18 2007 @ 0:01 CET by Thomas De Maesschalck
DailyTech claims they
received the final specs of AMD's upcoming Radeon X2900 XTX (R600) GPU. According to their intel, the chip has 700 million transistors, almost twice more than the 384 million transistors of the Radeon X1900 series.
As disclosed by DailyTech earlier this year, the GPU features a full 512-bit memory interface with support for GDDR3 and GDDR4. R580 was also similar in this regard as it supported GDDR3 and GDDR4.
On March 30, 2007, AMD will initially debut the R600 as the ATI Radeon X2900 XTX in two separate configurations: one for OEMs and another for retail. The OEM version is the full length 12" card that will appear in high-end systems.
ATI guidance claims the X2900 XTX retail card comes as a two-slot, 9.5" design with a vapor chamber cooler. Vapor chambers are already found on high-end CPU coolers, so it would be no surprise to see such cooling on a high-end GPU either. The OEM version of the card is a 12" layout and features a quiet fan cooler.
1GB of GDDR4 memory is the reference configuration for Radeon X2900 XTX. Memory on the reference X2900 XTX cards was supplied by Samsung.
Approximately one month later, the company will launch the GDDR3 version of the card. This card, dubbed the Radeon X2900 XT, features 512MB of GDDR3 and lower clock frequencies than the X2900 XTX. The X2900 XT is also one of the first Radeons to feature heatpipes on the reference design.
The Radeon X2900 XTX should be immediately available after launch.
