Korean memorymaker Hynix announced today that it has successfully complete the development of his 1GB DDR2 memory. It will begin sampling his 1GB DDR2 in eary Q4 2003, full-scale volume production will follow in early 2004 to coincide with the release of Intel his DDR2 chipset (The Grantsdale)
Hynix will utilize its Golden Chip 0.11-micron process technology for production of its 1Gb DDR2 and 512Mb DDR2. By effectively utilizing existing equipment, Golden Chip technology allows mass production of 0.11-micron technology products with minimum additional investment in capital expenditures. The company estimates the use of its 0.11-micron technology will reduce overall investment requirements by 50% compared to its competitors and will increase the number of die per wafer by 40% in comparison to its .13-micron Prime Chip technology, maintaining Hynix's competitive position in cost and technology.
Hynix's 1Gb and 512Mb DDR2 will be offered in 68-Ball, and 60/84-Ball Fine-Pitch Ball Grid Array (FBGA) package and fully complies with JEDEC specification and standards.