1066MHz memory modules are already on the market today but those are using overclocked DDR2 800MHz chips.
The DDR2-1066 components are produced on Micron’s industry-leading 78-nanometer 6F² process and operate at the JEDEC standard 1.8-volts. The 1 Gb component density allows for modules in densities ranging from 512 megabytes to 2 gigabytes. Micron has already generated industry support of its DDR2-1066 components from leading chipset companies including Advanced Micro Devices, Inc. (AMD), VIA Technologies, Inc. and Silicon Integrated Systems Corporation (SiS).
“AMD is committed to providing innovative technology platforms and solutions that allow our customers to realize their full potential,” said Bob Brewer, corporate vice president and general manager of AMD's desktop division. “In the design of our upcoming native quad-core client processors, which we expect will be available in the second half of 2007, AMD is planning for DDR2-1066 memory support in our integrated memory controller with the expectation that it will be compatible with any future JEDEC standard that may be adopted. Dependent upon validated platforms and JEDEC support, AMD hopes Micron’s innovative DDR2-1066 memory modules will provide an exemplary DRAM technology that can extend existing system designs and offer next-generation memory performance at a competitive price point.”
“The increasingly advanced graphic and video features implemented within our core logic chipset solutions are demanding ever greater memory bandwidth to ensure smooth system performance, and DDR2-1066 can cost effectively fulfill this need for multiple market segments,” said Chewei Lin, general manager of system platforms for VIA Technologies, Inc. “We see Micron’s DDR2-1066 as a good fit for our upcoming chipsets across all the leading processor platforms, and look forward to the performance boost it will afford both business and home users.”