|Rambus has defined all of the ingredients necessary to bring XDR to PC main memory. These ingredients include a broad range of XDIMM memory modules, programmable-width XDR DRAMs, buffers, connectors, clock generators, and comprehensive system design guidelines and documentation.
The XDIMM memory module will provide 12.8GB/s to 25.6GB/s of bandwidth, which is four times more memory module bandwidth in the same pin count and form factor as DDR2 DIMMs, giving the XDIMM the highest performance at the lowest system cost.
XDR memory's novel system topology allows point-to-point differential data interconnects to scale to multi-gigahertz speeds, while the bussed address and command signals allow a scalable range of memory system capacity supporting from one to 36 DRAM devices. XDR offers a roadmap to 6.4GHz and can scale to interface widths of up to 128-bits, enabling memory system bandwidths up to 100GB/s, 16 times more than today?s 6.4GB/s memory systems. XDR DRAMs will be available in multiple speed bins, device densities, and device widths. With densities ranging from 256Mb to 8Gb, and device widths ranging from x1 to x32, XDR DRAM satisfies the needs of both high-bandwidth and high-capacity systems.
Samsung, Elpida, and Toshiba are all DRAM licensees of Rambus's latest memory interface technology.
More information about XDR can be found here