PhysOrg reports about engineers who have grown "forests" of tiny carbon nanotube cylinders onto the surface of computer chips to enhance heat dissipation:
The carpetlike growth of nanotubes has been shown to outperform conventional "thermal interface materials." Like those materials, the nanotube layer does not require elaborate clean-room environments, representing a possible low-cost manufacturing approach to keep future chips from overheating and reduce the size of cooling systems, said Placidus B. Amama, a postdoctoral research associate at the Birck Nanotechnology Center in Purdue's Discovery Park.
Researchers are trying to develop new types of thermal interface materials that conduct heat more efficiently than conventional materials, improving overall performance and helping to meet cooling needs of future chips that will produce more heat than current microprocessors. The materials, which are sandwiched between silicon chips and the metal heat sinks, fill gaps and irregularities between the chip and metal surfaces to enhance heat flow between the two.
The method developed by the Purdue researchers enables them to create a nanotube interface that conforms to a heat sink's uneven surface, conducting heat with less resistance than comparable interface materials currently in use by industry, said doctoral student Baratunde A. Cola.