Posted on Wednesday, November 07 2007 @ 13:03 CET by Thomas De Maesschalck
OCZ has released a new memory module series called Reaper X. These modules use a new dual heatpipe formation to cool the memory chips.
ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme efficiency due to a new dual copper heat pipe design. Each memory chip is in direct contact with a thermo-conductive pipe that guides the performance robbing heat away from key memory components and quickly dissipates it through the aluminum fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.
The 800MHz module runs at 4-4-3-15 timings with a voltage of 2.1V.
