Since Intel's official launch of the new Penryn series of processors in November, key IC substrate makers are all benefiting from small volume production of new flip-chip (FC) substrates. With more substrate layers required for high-end processors and graphics chips, substrate makers from Taiwan are optimistically guiding an over 25% growth in demand in 2008.
IC substrate makers including Japan-based Ibiden, NGK Spark Plug and Shinko, as well as Taiwan-based Nanya Printed Circuit Board (NPC) have already started shipping 14-layer FC substrates to Intel in small volumes, the makers said.
As shipments of the new CPUs are expected to ramp up in volume in 2008, the industry players estimate that Intel will consume about 25-30% of total FC substrate capacity next year. However, from the supply side, most of the major substrate makers do not, currently, have any firm expansion plans, with capacity expected to only increase by a maximum of 10% next year.
New-generation graphics chips will also boost demand for more substrate layers. Graphics chip makers including AMD and Nvidia are also growing their substrate layer demand for entry-level graphics chips from six to eight layers.
Intel 45nm CPUs to spur substrate demand by 25%
Posted on Saturday, Nov 24 2007 @ 09:10 CET by Thomas De Maesschalck