In an interview Tuesday (Dec. 11) during the International Electron Device Meeting here, John Pellerin, AMD's director of logic technology development and project leader on a joint development effort with IBM Corp., said the company expects to start shipping the new processors in the second half of 2008.
While ramping 45-nm production early next year, AMD said that it will retain the option to include high-k/ metal gates in that generation, and will include high-k/metal gate technology in its 32-nm production generation.
Intel rolled out 45-nm high-k chips in November. Pellerin said AMD is focusing more on customer applications for its high-k chips rather than the process technology race. "We're not selling process technology," he stressed.
AMD's 45-nm technology has been transferred to its Fab 36 in Dresden, Germany. The process incorporates its "strain engineering" technology advances. AMD also helped drive immersion lithography for 45-nm, Pellerin claimed. "We're comfortable with the maturity of our yields" he added.
Pellerin leads a team of about 70 engineers in Hopewell Junction, N.Y., that is pushing AMD's high-k dielectric development for 45- and 32-nm processors. AMD recent extended its high-k chip development agreement with IBM through 2011 with a heavier emphasis on R&D. The chip maker is working more closely with IBM's Yorktown Heights, N.Y., research staff, he said.
AMD downplays process race
Posted on Friday, December 14 2007 @ 3:05 CET by Thomas De Maesschalck