Memory firm Micron said today that they have deliverd the industry's first 4GB DDRII registered memory module to Intel.
The industry-standard, 240-pin PC2-4300 DDR2 RDIMM is populated with thirty-six one gigabit (1Gb) DDR2 components using a stacked FBGA technology.
“Micron's demonstration of a 4GB RDIMM and the underlying 1Gb DDR2 technology is another important step in enabling Intel server platform customers with the latest high-density solutions,” said Pete MacWilliams, Intel Senior Fellow, Intel Corporation.
“We are leveraging Micron’s leading position with 1Gb DDR2 to become the first supplier to demonstrate these high-density DDR2 RDIMMs,” said Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for Micron’s Computing and Consumer Group. “4GB DDR2 RDIMMs are the highest-density modules available today, enabling server and workstation customers to ship systems containing 16GB of DDR2 memory while only populating four module slots.”