Also, the use of advanced AMD manufacturing process technology improvements allows for a new version of the Mobile AMD Sempron processor 2100+ that achieves up to a 15% reduction in thermal design power. All of these new products feature a consistent Socket S1, allowing for quicker development and delivery times through socket consistency and platform longevity.
“Our expanded embedded roadmap was born out of customer demand. The embedded market wanted to take full advantage of the unique AMD Direct Connect Architecture, and we are consistently providing additional options for these customers, often with specific requested features above those offered in our mainstream product lines,” said Buddy Broeker, director, Embedded Computing Solutions Division at AMD. “As functionality in embedded systems continues to grow, both in commercial and consumer products, AMD provides leading-edge technology at the right time for the market.”
Coupled with the new processors, a new chipset has also been added to the portfolio. Based on the award-winning AMD 690 Series chipsets, the AMD M690E provides additional display design flexibility for embedded graphics and enables seamless playback of high definition video content for embedded applications.
In addition to significant traction in commercial embedded markets such as storage and telecommunications, and strong partnerships with embedded infrastructure partners such as Aaeon, Axxtend, Fujitsu Siemens Computers, iEi, Kontron, and PDSi, there is currently strong demand for AMD technology in the digital signage, casino gaming and point-of-sale system markets.
In support of these markets, AMD is offering a COM Express form factor reference design kit which enables OEMs to quickly design embedded systems that deliver high quality graphics, high performance, and high I/O throughput.
All products announced this week are available immediately and are offered through the AMD Longevity Program, which offers components for an industry-standard five year term and enables design consistency.