Intel to bundle plastic air ducts with its processors?

Posted on Wednesday, June 02 2004 @ 18:12 CEST by Thomas De Maesschalck
Some new info regarding Intel's BTX plans. Some source say that Intel might bundle plastic air ducts with their processors in future. These will be needed in BTX cases. The plan is that heatsinks for Intel CPUs in BTX cases will be 'passively' cooled, meaning that they don't have fans attached to them directly but trough an air duct.
Instead, the system and Intel processor cooling fans will be mounted on the BTX chassis, and air must therefore be drawn across these huge passive heatsinks, and this is planned by using this plastic ducting.

We're not precisely sure why Intel is planning to do this, but mebbe we'll try and track down one of Intel's nicest shareholders, 'Buffalo' Bill O. Leszinske, Jr. and ask him why.

In the meantime it's speculated that either Intel thinks that the chassis manufacturers can't do the job properly, or, perhaps rather more likely, Intel thinks that it can drive the market toward BTX chassis by creating a 'consumer demand'.

After all if the box says something like 'designed for BTX Form Factor chassis, then whats a n00b to do?

As these ducts are quite large, and if this is all correct, then surely there'll be some increase in the size of the box that holds a retail Intel processor? So for retailers and distributors they may have to hold less stock than they currently do.
Source: The Inq

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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