TSMC: 40nm in 2009, 300mm expansion on track

Posted on Tuesday, Jul 29 2008 @ 03:15 CEST by Thomas De Maesschalck
DigiTimes heard TSMC stated at a ceremony that its 12-inch (300mm) wafer production expansion will be on track and that 40nm process node will be introduced in 2009.
Tsai said equipment move-in at P4 and Fab 14 in Tainan, both 12-inch fabs, is already scheduled and on track. The company will also start volume production on 40nm at Fab 14 in 2009, he said. He also updated that P4 will have equipment move-in during late 2008 with a monthly capacity of 35,000 12-inch equivalent wafers planned for the initial stages.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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