Posted on Tuesday, July 29 2008 @ 3:15 CEST by Thomas De Maesschalck
DigiTimes
heard TSMC stated at a ceremony that its 12-inch (300mm) wafer production expansion will be on track and that 40nm process node will be introduced in 2009.
Tsai said equipment move-in at P4 and Fab 14 in Tainan, both 12-inch fabs, is already scheduled and on track. The company will also start volume production on 40nm at Fab 14 in 2009, he said. He also updated that P4 will have equipment move-in during late 2008 with a monthly capacity of 35,000 12-inch equivalent wafers planned for the initial stages.
