Micron has unveiled new e-MMC embedded memory chips that feature a storage capacity of 32GB.
At 32GB, they are the highest densities available on the market today and are fully compliant with MMC standards. In addition, these newest e-MMC devices from Micron take advantage of the company’s industry-leading 34nm MLC NAND process technology, and feature an extended temperature range (-40C to +85C) for automotive and industrial applications. Micron’s new e-MMC product offerings will give consumers a significant increase in storage capacity for songs, pictures, and video, while also providing advanced NAND management features for application designers to simplify product designs and speed time-to-market. Customer samples are expected by the end of August with mass production expected in the second half of this year.
“e-MMC NAND devices are an effective solution for the needs of many consumer applications like cameras, cell phones, PDAs, and automotive infotainment systems. As an example, a 32GB e-MMC can hold 16,000 high-resolution digital photos, 8,000 songs, or up to 20 hours of high-definition video,” said Graham Robinson, Director of Segment Marketing for Micron’s memory group. Micron’s e-MMC products also greatly simplify system design by removing the requirements of the host memory controller to support NAND software drivers and complex NAND management techniques, including error correction code (ECC), wear leveling, and bad block management—replacing all of this complexity with a simple and ubiquitous MMC interface.
In addition to the impressive storage and feature options, Micron is providing e-MMC products qualified at extended temperatures, which makes them ideal for in-dash applications like navigation systems and other automotive applications that require a more robust operating range. Further, the JEDEC-standard interface minimizes the need for host software to accommodate process node migrations. “Ultimately, because Micron manufactures NAND, we are able to capitalize on our outstanding process technology, well-established IP, and a deep commitment to forwarding NAND memory to bring products like this to market. In fact, we also have the capability to pair e-MMC devices with low-power DRAM in Multi-Chip Packages (MCPs). Ultimately, our recent move to the 34nm process was a major accomplishment and these product lines directly benefit from that innovation,” said Robinson.
Micron’s e-MMC embedded memory offerings span from 1GB to 32GB devices and combine high-quality MLC NAND Flash memory with a high-speed MultiMediaCard (MMC) controller in a low-profile BGA package that measures a mere 14mm x 18mm x 1.4mm.