Intel WIMAX chips to be built on 0.13 micron process from TSMC

Posted on Wednesday, September 08 2004 @ 19:07 CEST by Thomas De Maesschalck
Intel's Rosedale, which supports the 802.16 standard, will be produced using a 0.13-micron process at TSMC according to Digitimes' sources. Production of these chips will later change to a 90nm process, when they will be made by Intel.
The chipset will first be used in customer premise equipment (CPE) products and introduced in handheld devices by 2007, according to Sean Maloney, Intel Communications executive vice president and general manager.

Michael Chen, director of sales and marketing at Intel Communications Asia-Pacific stated that WiMAX technology enables chipmakers to provide a single iteration of a product for a wide range of applications. Taiwan-based makers are now gearing up to produce CPE products based on the IEEE802.16 standard, whereas makers in China and South Korea have the potential to supply base-station development, Chen stated.

Lin Long-song, president and general manager of the Intel Innovation Center in Taiwan, said the technology should benefit the CLEC (competitive local exchange carrier) industry since the makers will be able to establish the infrastructure without support from ILECs (incumbent local exchange carriers).

In related news, Intel will increase the number of staff at its Taiwan Innovation Center to 100 in the near future, from 50-60 currently, Lin added.
Source: DigiTimes

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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