Posted on Tuesday, November 18 2008 @ 2:14 CET by Thomas De MaesschalckThe embedded processors will come in the ball-grid array package, and a reduced board footprint (package-size). At the heart of this core-logic is the AMD 780E northbridge. It is a reworked 780G chip with reduced thermal footprints. It will provide the CPU with a HyperTransport 3.0 (up to 5.6 GT/s) connection. This northbridge embeds a ATI Radeon HD 3300-class integrated graphics (IGP) which is AMD Sideport-capable. This adds the provision of adding DDR3 memory chips on the board to serve as video-memory. The northbridge provides an A-Link 2.0 connection (PCI-Express 2.0 x4) to the AMD SB7x0 class southbridge. The northbridge also features a native PCI-E multiplex to allow ATI CrossfireX with two PCI-E 2.0 x8 electrical connections. The SB7x0 southbridge provides up to six SATA II channels, 12 USB 2.0 connections, HD Audio, among others.
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