Samsung presents 2Gb DDR2 DRAMs

Posted on Tuesday, Sep 21 2004 @ 17:18 CEST by Thomas De Maesschalck
Samsung announces the world's first 2Gb DDR2 SDRAM memory using an 80nm production process.
“Samsung developed the DDR2 SDRAM using an advanced 80nm process technology, overcoming the industry expectations that 2Gb DRAM manufacture would require sub 65nm circuitry,” Samsung said in the statement.

The new DRAM technology breakthroughs include a 3D transistor technology, recess channel array transistor (RCAT), and a new concept architecture process. First introduced 2003, RCAT is a technology unique to Samsung that reduces transistor area space by implementing a 3-D structural design, increasing the integration level for higher density on a given area.

To address the high performance features of the DDR2 specification, Samsung adopted a double poly gate technology, 20-angstrom level ultra thin oxide film process, and a triple-layer metal circuitry. The high speed process technology coupled with the feasible 80nm technology also advances the time-to-market availability of the new DDR2 device.

The 2Gb DDR2 devices meet fine-pitch ball grid array (FBGA) package specifications for DDR2. Even without modifications, the devices can directly drive module density levels of Gigabyte (GB) scale; 2GB, 4GB and 8GB.
The mass production is slated for the second half of 2005

Source: X-bit Labs


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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