An AMD patent approved on October the 5th last has interesting implications for the system builder future.
US patent number 6,800,933 was filed on the 23rd of April 2001, with the following abstract: "Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate."
A source who understands this sort of stuff said that the patent could be a way of mastering problems associated with 65 nanometre technology..
Further details over at The Inquirer
AMD gets patent for peltier cooler on chip
Posted on Thursday, October 21 2004 @ 23:32 CEST by Thomas De Maesschalck