South Korean electronics giant Samsung has started shipments of memory modules based on 2Gb 50nm DDR3 memory chips. This includes a 16GB RIMM module and a 8GB RDIMM module.
Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8GB RDIMM (registered dual inline memory module). Last September, a 50nm-class 2Gb DDR3 was introduced for PC applications.
The 16GB high density module operates at 1066 Megabits per second (Mbps), which allows 192GB of total memory density for a 2-socket CPU server system. Samsung also is the first to offer 16GB RDIMMs operating at 1.35 volts, providing around 20 percent savings in power consumption over 1.5V DDR3 solutions.
In addition, the 16GB RDIMM features a dual-die package configuration, which is more efficient in cost and performance over the widely discussed quad-die configuration.
The 2Gb DDR3 consumes at least 40 percent less power than 1Gb configurations, supporting strong industry demand for lower power consumption, which is particularly important with server systems, as well as the new generation of notebooks.