Copper-diamond alloy promises better cooling

Posted on Wednesday, Apr 08 2009 @ 05:13 CEST by Thomas De Maesschalck
Scientists at the Fraunhofer-Forscher are working on a new copper-diamond alloy material, this could be useful for processor coolers or cooling devices for notebooks. Diamond conducts heat five times better than copper.
The result is a bond with 1.5 times the heat conduction of copper. Another advantage is that the material does not expand too much when heated, otherwise it couldn't be used in electronic devices.

It's not easy to create a stable bond between copper and diamond. The researchers use small amounts of chrome, which will form carbide-layers on the diamond, allowing copper to create bonds. It's possible that there are other materials with similar features.
More details at Hardware.info.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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