Bright Side of News brings another NVIDIA rumor, the site claims the company is confident the GT300 will be a winner. The chip will reportedly pack 2.4 billion transistors in a 495mm² die, that's one billion more transistors in a die that's 81mm² smaller than the original 65nm GT200.
Yes, you've read that correctly. 2.4 billion in less than 500mm2 will put sweat on both ATI and Intel's forehead, since this chip could be profitably manufactured and yet pack performance to potentially blew the competition out of the water. Each of original 65nm GT200 chips took 576mm2 of wafer space, while 55nm refresh GT206/GT200b eats up 490mm2.
In comparison, Intel's high-end Larrabee part is manufactured in 45nm and takes around 600mm2.
Now, if you are wondering why nVidia created a single-PCB GTX295, think again. This part is more than an engineering exercise - but let us put it in this perspective - if nVidia managed to put 2.4 billion transistors in less than 500mm2, with an interesting performance delta between GT200-GT300 in clock-per-clock comparison… we could say that Jen-Hsun definitely opened a can of whoop-ass on its competitors.