Posted on Wednesday, June 10 2009 @ 1:20 CEST by Thomas De Maesschalck
DigiTimes
reports Taiwanese foundry TSMC continues to expand its 300mm fab capacity, the company aims to increase foundry capacity 11 percent this year.
Taiwan Semiconductor Manufacturing Company (TSMC) is continuing to expand its 12-inch wafer foundry capacity, aiming at an 11% increase from 2008 and to account for 42% of its aggregate foundry capacity by the end of 2009, according to industry sources.
TSMC's expansion for 2009 focuses on its Fab 12, where annual capacity will reach an equivalent of 220,000 12-inch wafers in the third quarter and further to 250,000 wafers in the fourth quarter of 2009, indicated the sources. Through the expansion, the chipmaker aims to promote utilization rate of its 40/45nm node.
