DigiTimes heard AMD plans to introduce its Congo platform for ulta-thin notebooks at the end of October or early November. This platform was originally scheduled for late July but was delayed to due a lack of demand for ultraportable laptops.
AMD's next generation ultra-thin notebook platform (Congo) will feature a dual-core Turion Neo X2 L625 or Athlon Neo X2 L335/L325 or single-core Athlon Neo MV-40 processor and M780G chipsets.
Although AMD has not yet announced the Congo platform, Hewlett-Packard (HP) has already launched s 12.1-inch ultra-thin notebook (DV2-1113AX) in Taiwan at a price at NT$25,000 (US$776.24) that features an Athlon Neo MV-40 CPU (that will be used in the Congo platform) combined with the RS690E chipset from the Yukon platform.
Over the next two years Congo will be succeeded by Nile and Brazos.