Samsung says that using its Wafer Supporting System technology to make wafers thinner during design processing, it has managed to minimize overall die thickness as well as decrease the space between the stacked dies. "As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution," the company said in a statement.Read more at EE Times
Samsung developed eight-die MCP for 3G cell phones
Posted on Monday, January 10 2005 @ 12:41 CET by Thomas De Maesschalck
Samsung has developed an eight-die multi-chip package (MCP) technology for usage in high-capacity mobile devices like 3G cell phones and other tightly integrated mobile devices.