AMD Inks Substrate Agreement for 65nm/300mm Production

Posted on Tuesday, January 18 2005 @ 17:01 CET by Thomas De Maesschalck

The Soitec Group, a leading supplier of engineering substrate solutions for chipmakers said Monday it and Advanced Micro Devices had signed an agreement under which AMD will continue to use the Soitek’s UNIBOND wafers for its future production using 200mm and 300mm wafers.

More info at X-bit Labs

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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