Currently, chips are built up, layer by layer, through a process called photolithography. A layer of silicon, metal, or some other material is deposited on a chip and coated with a light-sensitive material, called a photoresist. Light shining through a kind of stencil — a “mask” — projects a detailed pattern onto the photoresist, which hardens where it’s exposed. The unhardened photoresist is washed away, and chemicals etch away the bare material underneath.
The problem is that chip features are now significantly smaller than the wavelength of the light used to make them. Manufacturers have developed various tricks to get light to produce patterns smaller than its own wavelength, but they won’t work at smaller scales..
MIT researchers working on self-assembling computer chips
Posted on Sunday, March 21 2010 @ 14:10 CET by Thomas De Maesschalck