DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!
   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
DarkVision Hardware - Daily tech news
September 15, 2019 
Main Menu
News archives

Who's Online
There are currently 136 people online.


Latest Reviews
Ewin Racing Flash gaming chair
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset

Follow us

Intel to expand 32nm process to SoCs and communication chips

Posted on Wednesday, June 16 2010 @ 19:00:39 CEST by

Intel revealed it has developed a new version of its 32nm process for SoCs and RF/mobile communication chips:
Intel is the only company in the world shipping products built on a 32nm (32 billionths of a meter) manufacturing process, and the only one with high-k/metal gate, a technology that delivers superior performance and energy efficiency. Now, Intel engineers have developed a new version of this process -- first created for CPUs - to make SoCs, particularly those requiring low power and RF (radio frequency)/mobile communications. A full array of features has been added, including a triple-transistor architecture with high frequency performance, low leakage power and good noise performance, and high breakdown power amplifier transistors. The latter is needed for CMOS power amplifiers in integrated radio applications such as Wi-Fi, WiMAX, cellular, and GPS. The process provides noise isolation through deep-n-well and high resistivity substrates, and includes high quality inductors, resistors, and varactors. Intel is describing this new technology at the 2010 Symposia on VLSI Technology and Circuits this week. Further details are available here (PDF 28KB).


Use Disqus to post new comments, the old comments are listed below.

Re: Intel to expand 32nm process to SoCs and communication chips
by Anonymous on Thursday, June 17 2010 @ 02:19:19 CEST
Beautiful, just let us know when your design team figures out how to implement USB 3 on your chipsets. Oh wait that's right. You said you'd do that by 2015.


DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2019 DM Media Group bvba