DigiTimes reports SMIC has entered 65nm process volume production:
Semiconductor Manufacturing International Corporation (SMCI) has shipped more than 10,000 wafers through its low-leakage 65nm process since the third quarter of 2009, successfully moving the node into volume production, the China-based foundry announced on August 3.
SMIC processes 65nm wafers at its 12-inch facility in Beijing, where capacity will be ramped up to 25,000 wafers a month by the end of 2010. The company has estimated its capex for 2010 at US$330 million, which will mainly be allocated to capacity expansions at its wafer fabs in Beijing and Shanghai.
In addition, SMIC revealed it is transitioning to a 55nm process, a 90% linear-shrink process from 65nm including I/O and analog circuits.