Posted on Monday, January 03 2011 @ 21:03 CET by Thomas De Maesschalck
Sources at USB 3.0 chip makers
told DigiTimes that they will make a push into AMD's new Ontario and Zacate platforms. The first chipset with native USB 3.0 support is expected to be introduced in July by AMD, while Intel won't integrate it until the introduction of Ivy Bridge in January 2012.
AMD is already set to include native support for four USB 3.0 ports on its upcoming 32nm Hudson-D3/M3 chipsets, which will pair with its 32nm Llano APU targeting mid-range/high-end notebooks and desktops as well as ultra-thin notebooks, in July.
Meanwhile, since the transition to USB 3.0 will be a huge process to handle, Intel is aiming to integrate USB 3.0 functions only in high-end motherboards initially to minimize the possible risks and will gradually increase the overall penetration to 80% by the end of 2012.
