Posted on Wednesday, November 30 2011 @ 21:56 CET by Thomas De Maesschalck
EE Times
reports Toshiba is reorganizing to cope with falling demand for consumer products from the western hemisphere. The firm will close three manufacturing plants and consolidate much of its discrete, analog and imaging IC production into three others.
Toshiba Corp. has announced it plans to close three manufacturing facilities and consolidate much of its discrete, analog and imaging IC production into three others, as part of a response to a fall off in demand for consumer products from the western hemisphere. At the same time Toshiba said it would cut production at some of its semiconductor facilities, including one making ASICs and MCUs, from now until early January 2012.
Toshiba said the slowdown was notably in demand for PCs and TVs in Europe and the United States.
As a result, in the first half of its 2012 fiscal year Toshiba plans to close wafer fabs used for optical components in Kitakyushu and Hamaoka as well as an assembly plant used for power semiconductors at Mobara. The company added that regular employees at the affected facilities will, in principle, be redeployed within Toshiba Group.
