Cooler Master reveals Vertical Vapor Chamber CPU cooling technology

Posted on Tuesday, Jan 17 2012 @ 18:58 CET by Thomas De Maesschalck
Cooler Master send out a press release to detail the new Vertical Vapor Chamber technology used by its new TPC 812 processor cooler. Retail availability is expected by CeBIT 2012.
After releasing the world’s first heatpipe heatsink in 2000, Cooler Master announces that it will begin to phase in Vertical Vapor Chamber technology into its upcoming retail CPU heatsinks; a technology initially developed by Cooler Master’s OEM and industrial cooling division.

Vertical Vapor Chambers feature less than half the air resistance by reducing airflow vortexes and noise generated by air streaming through a heatsink. At the same time vertical vapor chambers exhibit 3 times the fin contact area, enabling faster and more efficient transfer of heat from the vapor chambers to the fins, and overall more efficient use of the available fin surface area.

As a result, Vertical Vapor Chambers allow Cooler Master to develop cooling solutions with greatly reduced noise footprints or increased cooling performance in excess of 200W at the same or lower noise level as without vertical vapor chambers.

The high-end tower heatsink Cooler Master TPC-812, the first product based on this latest technology and Cooler Masters leading product development process will be officially released to the market in a few weeks during CeBIT 2012.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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