Posted on Thursday, February 09 2012 @ 21:51 CET by Thomas De Maesschalck
X-bit Labs
reports the IBM chip alliance (which includes IBM, Globalfoundries and Samsung Electronics) will share details about the future of chip production at the 2012 Common Platform technology forum to be held at the Santa Clara, California, on March 14, 2012. The firms will discuss 28nm production, as well as 20nm, 14nm, and 450mm wafer production.
"The Common Platform alliance is built upon an legacy of invention and deep commitment to research and development from IBM. The combined expertise of the companies involved is driving truly breakthrough technology innovations for semiconductor manufacturing. Our focus on building the most extensive and open ecosystem around our core manufacturing capabilities delivers customers a flexible and risk-free way to bring a wide range of semiconductor products to market," said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the common platform alliance.
