Third-gen ultrabooks to get 3D, high-quality interfaces

With the addition of touchscreen control and security measures and new component specifications such as chassis, battery, hinge and solid state drive (SSD), the third-generation ultrabooks are expected to further realize Intel's design intents for ultrabooks, the sources noted.

For chassis, Intel has found a new chassis manufacturing method from the automobile and aerospace industries that can significantly reduce costs by 65%. The new chassis is expected to appear in 2013, allowing the third-generation ultrabooks to further drop their production costs, the sources pointed out.