DigiTimes heard rumors about Intel's design suggestions for third-generation Haswell-based ultrabooks. Slated to be released in Q2 2013, these systems may offer 3D displays, HD quality user interfaces and adoption of sensors.
With the addition of touchscreen control and security measures and new component specifications such as chassis, battery, hinge and solid state drive (SSD), the third-generation ultrabooks are expected to further realize Intel's design intents for ultrabooks, the sources noted.
For chassis, Intel has found a new chassis manufacturing method from the automobile and aerospace industries that can significantly reduce costs by 65%. The new chassis is expected to appear in 2013, allowing the third-generation ultrabooks to further drop their production costs, the sources pointed out.