A leaked roadmap from Intel reveals that the chip giant plans to start its transition to BGA packaging by the end of 2013. Entry-level products like the Celeron and Pentium brands will be the first to go BGA, these chips will be SoCs that are soldered to the motherboard. These entry-level parts will all be based on the "BayTrail-D" architecture, with TDP ratings of just 10W even for the quad-core parts.
These include the Celeron J1750, Celeron J1850, and Pentium J2850. Celeron J1750 is a dual-core part, with the CPU cores clocked at 2.41 GHz, GPU at 792 MHz, and a TDP rated at just 10W. Celeron J1850, on the other hand, is a quad-core part, with its CPU cores clocked at 2.00 GHz, and the same 792 MHz GPU. Pentium J2850 tops the series, being a quad-core part with CPU cores running at 2.41 GHz, and GPU at 792 MHz. Both these quad-core parts stick to 10W TDP. Being SoCs, these chips integrate connectivity otherwise handled by a PCH, into the processor package.
It's unclear at this point whether Intel plans to completely switch from LGA to BGA packaging, but we can say for sure that BGA will not be limited to the entry-level segment. The second slide reveals that Intel will also release three quad-core Haswell-GT3 based chips for the performance-segment; the Core i5-4570R, i5-4670R, and Core i7-4770R. All three parts have a 65W TDP.
The i5-4570R features 2.70 GHz CPU clocks, 3.20 GHz Turbo Boost, 4 MB of L3 cache, Iris Pro 5200 graphics clocked at 1150 MHz, and 65W TDP. The i5-4670R ups that with 3.00 GHz CPU clocks, 3.70 GHz Turbo Boost, the same 4 MB of L3 cache, but faster Iris Pro graphics clocked at 1.30 GHz. Leading the pack is the Core i7-4770R, with 6 MB L3 cache, HyperThreading, 3.20 GHz CPU clocks, 3.90 GHz Turbo Boost, and the same 1.30 GHz graphics core.