G.Skill to show next-gen memory at IDF 2013

Posted on Thursday, Aug 29 2013 @ 15:28 CEST by Thomas De Maesschalck
G.Skill send out words that it will show off its new DDR3 memory modules as well as share plans for future DDR4 memory at next month's Intel Developer Forum:
G.SKILL International Co. Ltd., the leading high-performance memory designer and manufacturer, announced to participate this year’s Intel Developer Forum at San Francisco as part of Intel’s memory community at booth no. 165, displaying maximum DDR3 memory frequency & capacity on the new Intel® Core™ i7 processor family for socket LGA-2011 platform, also sharing plans for future technology such as DDR4.

“As this is our first time attending IDF, we are very excited to show our high performance quad channel DDR3 memory and also announce our plans for DDR4,” said Mark Yu – Technical Marketing at G.SKILL.
G.Skill TridentX

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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