EK debuts ASUS Maximus VI Extreme water block

Posted on Tuesday, September 17 2013 @ 20:28 CEST by Thomas De Maesschalck
EK Waterblocks introduces a new liquid cooling block for the ASUS Maximus VI Extreme motherboard. It's available in four different versions (nickel, acetal+nickel, nickel (original CSQ) and acetal+nickel (original CSQ) but all versions have the same price: 128.05EUR. The only difference between these four versions is aesthetic.
EK Water Blocks, Ljubljana based premium water cooling gear manufacturer, is proud to introduce the EK-FB ASUS M6E series Full-Board water block for ASUS® Maximus VI Extreme, a Z87 Express based premium 4th generation Intel® Core® LGA-1150 socket motherboard.

EK-FB ASUS M6E water block is a complete liquid cooling solution for ASUS Maximus VI Extreme motherboard. The water blocks directly cools Intel Z87 southbridge (PCH), PLX PEX 8474 PCIe lane splitter as well as power regulation (VRM / MOSFETs) module. It is a high flow water block that can be easily used with systems using weaker water pumps. Base of these water blocks are made of (nickel plated - depending on the model and variant) electrolytic copper while the top is made of quality POM Acetal material.

Thanks to the all-in-one design the whole cooling solution requires only two industry standard G1/4 fittings. The sealing is ensured by the use of quality rubber gaskets. The nickel plated brass screw-in standoffs are already pre-installed and allow for easy and trouble-free installation by utilizing both original motherboard backplates. The water block is available in four visually different versions.
EK ASUS Maximus VI Extreme water block


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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