Powerchip 30nm DRAM production suffering from low yields

Posted on Wednesday, October 02 2013 @ 12:56 CEST by Thomas De Maesschalck
DigiTimes writes a portion of Powerchip's 30nm DRAM production is suffering from low yield rates due to an issue with ion implantation equipment. The issue affects about 7,000 to 8,000 of the wafers that Kingston has booked and may lead to further increases in DRAM pricing.
The yield problem was caused by ion implantation equipment, said the sources. Output from the affected production capacity may not be completely scrapped, but they definitely cannot be sold to PC OEMs due to quality concerns, the sources indicated.

Kingston has booked a capacity for about 20,000 wafers monthly at Powerchip's P3 12-inch wafer fab, the sources revealed. Powerchip uses 30nm process technology to manufacture DRAM chips for Kingston.

Yield problems with Powerchip's 30nm process will likely worsen the shortage of DRAM chips on the contract market, the sources noted.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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