Mushkin's new heatsink design

Posted on Thursday, August 04 2005 @ 5:15 CEST by Thomas De Maesschalck

Mushkin recently announced a radically new heatsink design for their top memory modules. They claim it offers greatly-improved thermal dissipation capabilities courtesy of a larger surface area, a new aero-efficient design and an advanced thermal adhesive. Check it out over here.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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