Posted on Wednesday, May 06 2015 @ 20:50 CEST by Thomas De Maesschalck
First up is news about the company's Radeon M300 series for the laptop market, these new cards will be available in the next couple of weeks but it seems few details were revealed.
The firm also disclosed that its next-gen GPU with HBM will be coming in the next few weeks but they were pretty vague about that as well. No actual launch schedule was revealed but AMD CEO Lisa Su said it will be at a big event so this most likely means Computex in early June or E3 around mid-June.
AMD confirmed its next-gen GPU will have High Bandwidth Memory (HBM) but oddly enough the slides don't seem to talk about the Radeon R9 390X so perhaps the naming isn't finalized yet. Lisa Su mentioned the new card will have a new form factor, which may confirm rumors that the card will be much shorter than current high-end cards because the memory will be stacked on the same package as the GPU core rather than spread across the PCB. The slide confirms rumors that AMD's next-gen GPU will use 2.5D stacking, future versions are expected to stack the memory on top of the GPU.
Unfortunately, no actual detail were revealed so if you were waiting for the specifications you'll have to wait a few weeks longer. AMD also made some vague statements about its 2016 GPU (Radeon R9 400 series?). These GPU will be made on a FinFET process (most likely 14nm) and promise twice the energy efficiency (presumably versus the upcoming Fiji GPU). This high-end part is codenamed Greenland, it's part of the Arctic Islands family and will receive second-generation HBM.
The firm also talked about its computing and graphics roadmap for 2016. That year AMD will introduce Socket AM4 FX-series processors based on the Zen core and 7th generation APUs that will use the share the same socket on the desktop platform. The FX line supports DDR4 while the new APUs will support DDR3 and DDR4.
Source: VideoCardz
